Join Inventec & Essemtec for an Advanced Technical Session on May 14th, 26 | Inventec

We are proud to organize with Essemtec a dedicated technical session focused on next-generation assembly techniques, bringing together expertise in precision jet printing and high-reliability soldering processes.

This event will highlight how innovation in materials and equipment is transforming electronics manufacturing from improving accuracy and yield to enabling more complex and high-value applications.

Inventec will present:

• Jet Printing Evolution – Low Volume to High Value presented by Manuel Schöllig : Exploring how jet printing has evolved into a fast, accurate, and reliable solution, driven by the combined expertise of materials and equipment innovation.
• Formic Acid Reflow – Fluxless Soldering for High-Reliability Electronics presented by Davis Troxtell: Introducing fluxless process that enhances reliability, reduces voiding, and eliminates post-reflow cleaning, ideal for advanced assemblies.

📍 May 14, 2026 | Noon to 3:45pm |  Vertex Applied Innovation Hub, Florida

This session is a great opportunity to dive into process optimization, advanced soldering technologies, and future-ready manufacturing approaches.

We look forward to connecting with you and sharing insights throughout the event.