INVENTEC Performance Chemicals will be exhibiting at SC26 – The International Conference for High Performance Computing, Networking, Storage, and Analysis, taking place on November 15–20, 2026, at McCormick Place in Chicago, Illinois.
Under the theme “HPC Unites”, the event brings together the global high-performance computing community to explore advances in AI, computing architectures, networking and next-generation infrastructure.
Through its THERMASOLV advanced dielectric cooling fluids, INVENTEC supports innovative thermal management technologies, including single-phase and two-phase immersion cooling as well as direct-to-chip cooling, helping address the growing performance, reliability and energy efficiency challenges of high-density computing systems.
Join us at Booth 1105 to discover how INVENTEC’s advanced cooling solutions can support the next generation of HPC and AI infrastructure.
