KILL AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset

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AiM Future requests that their press release NewsItemId: 20250812809031 issued August 28, 2025 “AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset” be killed.

The release was issued in error by AiM Future.

A replacement release will not be issued.

Recapiti

AIM Future Marketing Manager
Email: Sun.yim@aimfuture.ai
Tel: +81-10-2111-2728
Contact: Sunsoon Yim