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Cadence Design Systems, Inc.

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Computer grafica 3DHardware informaticoIndustriaSoftwareTecnica

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22/04/2026
Mercato del lavoro
Industria
Software
Hardware informatico
Computer grafica 3D
Tecnica
Tecnologie Varie
Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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15/04/2026
Mercato del lavoro
Industria
Hardware informatico
Tecnica
Software
Web e Social Network
Cadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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06/04/2026
Web e Social Network
Telefonia e Varie
Finanza
Mercato azionario
Software
Hardware informatico
Computer grafica 3D
Ingegneria
Tecnica
Industria
Cadence Announces First Quarter 2026 Financial Results Webcast
Fonte
Cadence Design Systems, Inc.
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Business Wire
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16/03/2026
Ingegneria
Hardware informatico
Tecnica
Industria
Software
Mercato del lavoro
Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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25/02/2026
Eventi
Web e Social Network
Hardware informatico
Computer grafica 3D
Tecnica
Software
Cadence’s Anirudh Devgan to Present at Morgan Stanley Conference
Fonte
Cadence Design Systems, Inc.
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Business Wire
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23/02/2026
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Ingegneria
Hardware informatico
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Industria
Software
Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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17/02/2026
Hardware informatico
Computer grafica 3D
Tecnica
Software
Web e Social Network
Telefonia e Varie
Mercato azionario
Cadence Reports Fourth Quarter and Fiscal Year 2025 Financial Results
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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10/02/2026
Ingegneria
Hardware informatico
Tecnica
Industria
Software
Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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21/01/2026
Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications
Fonte
Cadence Design Systems, Inc.
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Business Wire
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13/01/2026
Hardware informatico
Tecnica
Software
Industria
Cadence Delivers Enterprise-Level Reliability with Next-Gen Low-Power DRAM for AI Applications Featuring Microsoft RAIDDR ECC Technology
Fonte
Cadence Design Systems, Inc.
Emittente
Business Wire
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