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JEDEC Solid State Technology Association

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20/10/2025
Computer grafica 3D
Hardware informatico
Elettronica
Tecnica
Telefonia e Varie
Industria
JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
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06/10/2025
Computer grafica 3D
Hardware informatico
Elettronica
Tecnica
Telefonia e Varie
Industria
UFS 5.0 Is Coming: JEDEC® Sets the Stage for the Next Leap in Flash Storage
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
1.00
0
09/07/2025
Computer grafica 3D
Hardware informatico
Elettronica
Tecnica
Telefonia e Varie
Industria
JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
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16/04/2025
Industria
Information Technology
Elettronica
Tecnica
Hardware informatico
Software
Tecnologie Varie
Telefonia e Varie
Computer grafica 3D
JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
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31/07/2024
Computer grafica 3D
Hardware informatico
Elettronica
Tecnica
Telefonia e Varie
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
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22/07/2024
Computer grafica 3D
Hardware informatico
Elettronica
Tecnica
Telefonia e Varie
Industria
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
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0
10/07/2024
Industria
Telefonia e Varie
Tecnica
Hardware informatico
Tecnologie Varie
Software
Computer grafica 3D
Information Technology
Elettronica
JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations
Fonte
JEDEC Solid State Technology Association
Emittente
Business Wire
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